2026 SiC MOSFET Prices Rise Again: A 4-Step Guide for OEMs to Secure Supply
The BOM includes procurement of silicon carbide (SiC) MOSFETs, and you've likely already noticed changes in pricing this year. Industry forecasts project China's SiC device market size to reach approximately 110.9 billion yuan in 2026, a 32.4% year-over-year increase—the highest growth rate globally. The ramp-up of the 800V high-voltage platform, increased SiC usage per solar inverter from 1.2 to 2.1 units, and rising demand for bidirectional converters in energy storage have created a demand curve that significantly outpaces supply ramp-up. Infineon and STMicroelectronics have issued two rounds of price increase notices this year, with domestic manufacturers following suit. This article breaks down the logic behind these price hikes, provides trend forecasts, and offers a four-step procurement action guide: lock prices, dual-source, verify authenticity, and secure spot inventory.
20 Years of Expertise in Components: The ZenChip Story
From a spot-goods counter in Shenzhen's Huaqiangbei to a global component platform covering silicon carbide, embedded storage, and industrial printing. This story chronicles ZenChip's 20+ years of pushing the limits on authenticity, speed, and traceability.
End-to-end component supply from low-volume prototyping to high-volume mass production
In electronics R&D and manufacturing, the most critical and challenging hurdle is supply chain fragmentation for components. Issues such as material shortages during prototyping delaying progress, mismatches in materials during low-volume trials, unstable mass production supply, and inconsistent batch quality directly slow down project delivery and increase production costs.
Avoid Common Pitfalls in Component Procurement: Solving the Top Three Pain Points of Lead Time, Quality, and Substitutes
Electronics procurement often faces shortages, refurbished parts, and incompatible alternatives. Zenchip leverages its in-house lab and PhD FAE team to stock SiC, flash memory, and industrial storage, offering inventory assurance, comprehensive testing, and expert substitution validation to solve your top three sourcing challenges.
12 Key Differences and Pros/Cons: SiC MOS vs. Si MOS
As a core switching device of the third-generation wide-bandgap semiconductor, SiC MOSFETs leverage intrinsic material advantages to significantly outperform traditional silicon-based MOSFETs (Si MOS) in high-voltage, high-frequency, and high-temperature power conversion applications.
2026 Semiconductor Industry Trends: Rise of Domestic Chips and Supply Chain Restructuring
As the global semiconductor landscape continues to evolve, domestic chips have achieved breakthroughs across multiple sectors. This article provides an in-depth analysis of industry trends for 2026, covering advancements in advanced process nodes, innovations in packaging technologies, and progress in supply chain localization to support procurement decisions.
NOR Flash Selection Guide: Capacity, Interface, and Package Parameters
NOR Flash is widely used in embedded systems, IoT devices, and automotive electronics. This guide helps engineers quickly select the right part by comparing capacity, SPI/QPI interface protocols, and package types.
Preventing Counterfeit Electronic Components: A Full-Process Guide from Procurement to Inspection
Counterfeit components are the most hidden cost black hole in electronics manufacturing. Issues often surface only after reflow, causing line stoppages, rework, or total batch scrap. This article breaks down three lines of defense—from supplier audits and incoming inspection to deep lab testing—and provides an actionable checklist you can implement immediately.
Realtek NIC Chip Series Comparison: RTL8125 vs RTL8111 vs RTL8156
The Realtek Ethernet controller is widely used in industrial control, NAS, and networking devices. This article compares the core specifications and application scenarios of RTL8125 (2.5G), RTL8111 (1G), and RTL8156 (USB 3.0 to 2.5G).