SiC MOSFET Prices Surge Again in 2026: A Procurement Playbook for OEMs
If SiC MOSFETs are on your BOM, you've likely already noticed the shift in this year's pricing. Industry research now estimates China's SiC device market at approximately RMB 11.09 billion in 2026, up 32.4% year over year—the fastest-growing segment globally. On the demand side, 800V high-voltage platforms are scaling up, SiC content per PV inverter is rising from 1.2 to 2.1 devices, and energy-storage bidirectional converters are adding further demand—outpacing supply ramp-up. Global leaders Infineon and STMicroelectronics both issued their second round of price hikes in 2026, with domestic Chinese fabs following suit. This article outlines the key drivers, market outlook, and a 4-step procurement playbook to lock in pricing, diversify sourcing, verify authenticity, and secure spot inventory.
20 Years in Components: The ZenChip (Zhanqi Technology) Story
From a Shenzhen spot-trading counter to a global component platform: How ZenChip built a CNAS-accredited lab, 120M+ test records, and an in-stock sourcing platform over 20 years.
End-to-end component supply from low-volume prototyping to high-volume mass production
In electronics R&D and manufacturing, the most critical and challenging hurdle is supply chain fragmentation for components. Issues such as material shortages during prototyping delaying progress, mismatches in materials during low-volume trials, unstable mass production supply, and inconsistent batch quality directly slow down project delivery and increase production costs.
Avoid Common Pitfalls in Component Procurement: Solving the Top Three Pain Points of Lead Time, Quality, and Substitutes
Electronics procurement often faces shortages, refurbished parts, and incompatible alternatives. Zenchip leverages its in-house lab and PhD FAE team to stock SiC, flash memory, and industrial storage, offering inventory assurance, comprehensive testing, and expert substitution validation to solve your top three sourcing challenges.
12 Key Differences and Pros/Cons: SiC MOS vs. Si MOS
As a core switching device of the third-generation wide-bandgap semiconductor, SiC MOSFETs leverage intrinsic material advantages to significantly outperform traditional silicon-based MOSFETs (Si MOS) in high-voltage, high-frequency, and high-temperature power conversion applications.
Semiconductor Industry Trends 2026: Domestic Chip Growth and Supply Chain Restructuring
As the global semiconductor landscape evolves, domestic chips are breaking through across multiple sectors. This article analyzes 2026 trends, including advanced process technologies, packaging innovations, and supply chain localization.
NOR Flash Selection Guide: Capacity, Interface, and Packaging Explained
NOR Flash is widely used in embedded systems, IoT devices, and automotive electronics. This guide covers capacity, SPI/QPI interfaces, and packaging to help engineers make quick selections.
Counterfeit Component Prevention: From Procurement to Testing
Counterfeit chips pose a serious risk to electronics manufacturing. This article covers the complete anti-counterfeit workflow—from supplier audits and incoming inspection to CNAS lab testing.
Realtek Ethernet Chip Comparison: RTL8125 vs RTL8111 vs RTL8156
Realtek Ethernet controllers are widely used in industrial control, NAS, and networking equipment. This article compares the core specs and use cases of the RTL8125 (2.5G), RTL8111 (1G), and RTL8156 (USB 3.0 to 2.5G).).